JPH03205117A - マルチプランジャー成形金型 - Google Patents

マルチプランジャー成形金型

Info

Publication number
JPH03205117A
JPH03205117A JP2000264A JP26490A JPH03205117A JP H03205117 A JPH03205117 A JP H03205117A JP 2000264 A JP2000264 A JP 2000264A JP 26490 A JP26490 A JP 26490A JP H03205117 A JPH03205117 A JP H03205117A
Authority
JP
Japan
Prior art keywords
cull
resin
runners
runner
resin flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000264A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0575565B2 (en]
Inventor
Shoji Obara
小原　省治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2000264A priority Critical patent/JPH03205117A/ja
Priority to KR1019900022244A priority patent/KR970003930B1/ko
Priority to US07/635,654 priority patent/US5071334A/en
Publication of JPH03205117A publication Critical patent/JPH03205117A/ja
Publication of JPH0575565B2 publication Critical patent/JPH0575565B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2000264A 1990-01-05 1990-01-05 マルチプランジャー成形金型 Granted JPH03205117A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000264A JPH03205117A (ja) 1990-01-05 1990-01-05 マルチプランジャー成形金型
KR1019900022244A KR970003930B1 (ko) 1990-01-05 1990-12-28 멀티플런저 금형
US07/635,654 US5071334A (en) 1990-01-05 1990-12-28 Multiple transfer molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000264A JPH03205117A (ja) 1990-01-05 1990-01-05 マルチプランジャー成形金型

Publications (2)

Publication Number Publication Date
JPH03205117A true JPH03205117A (ja) 1991-09-06
JPH0575565B2 JPH0575565B2 (en]) 1993-10-20

Family

ID=11469053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000264A Granted JPH03205117A (ja) 1990-01-05 1990-01-05 マルチプランジャー成形金型

Country Status (3)

Country Link
US (1) US5071334A (en])
JP (1) JPH03205117A (en])
KR (1) KR970003930B1 (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015093462A (ja) * 2013-11-13 2015-05-18 アピックヤマダ株式会社 モールド金型
KR20200113899A (ko) * 2019-03-27 2020-10-07 허남욱 정량 정압 토출을 위한 핫러너 사출금형장치

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2564707B2 (ja) * 1991-01-09 1996-12-18 ローム株式会社 電子部品用リードフレームにおけるモールド部のマルチ式成形方法及び成形装置
KR960700875A (ko) * 1994-01-13 1996-02-24 나카지마 미치오 반도체 장치의 수지봉지 방법
US5624691A (en) * 1994-06-21 1997-04-29 Texas Instruments Incorporated Transfer mold design
US6531083B1 (en) * 1995-05-02 2003-03-11 Texas Instruments Incorporated Sproutless pre-packaged molding for component encapsulation
US5876765A (en) * 1995-11-09 1999-03-02 Micron Technology, Inc. Injection molding equipment for encapsulating semiconductor die and the like
US6001672A (en) 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
KR100224649B1 (ko) * 1997-03-25 1999-10-15 윤종용 방사형 런너를 갖는 반도체 성형 금형
US6214273B1 (en) * 1997-09-30 2001-04-10 Texas Instruments Incorporated Molding method with the use of modified runners
US6838319B1 (en) * 2000-08-31 2005-01-04 Micron Technology, Inc. Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically
US7220615B2 (en) 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US6444501B1 (en) * 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
JP2003243435A (ja) * 2002-02-14 2003-08-29 Hitachi Ltd 半導体集積回路装置の製造方法
KR100805338B1 (ko) * 2006-05-23 2008-02-21 평화산업주식회사 고무류 제품 제조용 ｈｒｂ 금형의 가류시간 단축 구조
JP6035330B2 (ja) * 2011-05-20 2016-11-30 アイエムフラックス インコーポレイテッド 射出成形装置用の非自然平衡供給システム
CN102765166A (zh) * 2012-08-03 2012-11-07 铜陵三佳山田科技有限公司 一种用于四组mgp模具的s型流道塑封体
KR101822565B1 (ko) * 2016-02-26 2018-01-26 서울과학기술대학교 산학협력단 핫 러너를 적용한 렌즈용 사출 성형품

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3779506A (en) * 1971-08-25 1973-12-18 Motorola Inc Apparatus for equalizing the flow rate of molding compound into each of a series of mold cavities
US4111635A (en) * 1977-04-01 1978-09-05 Rainville Company, Inc. Manifold in substantial alignment with plasticizer
JPS5849170B2 (ja) * 1977-10-25 1983-11-02 旭化成株式会社 コ−トハンガ−型ゲ−トを有する射出成形用金型
US4451224A (en) * 1982-03-25 1984-05-29 General Electric Company Mold device for making plastic articles from resin
US4697784A (en) * 1985-05-15 1987-10-06 Texas Instruments Incorporated Injection mold for producing the housings of integrated circuits
JPS6211621A (ja) * 1985-07-10 1987-01-20 Canon Inc 射出成形機
JPS62122136A (ja) * 1985-11-08 1987-06-03 Hitachi Ltd レジンモールド半導体の製造方法および装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015093462A (ja) * 2013-11-13 2015-05-18 アピックヤマダ株式会社 モールド金型
KR20200113899A (ko) * 2019-03-27 2020-10-07 허남욱 정량 정압 토출을 위한 핫러너 사출금형장치

Also Published As

Publication number Publication date
JPH0575565B2 (en]) 1993-10-20
US5071334A (en) 1991-12-10
KR970003930B1 (ko) 1997-03-24
KR910015028A (ko) 1991-08-31

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